Sony provides high-density mounting packages responding to a wide range of specific needs by incorporating the latest advances in key technology. Driving Force Behind High-Density Mounted Packaging technology holds the key to the realization of digital VCR, digital cellular telephones, notebook PCs, and other multimedia systems merging audiovisual and information technologies. Sony therefore continues to offer advanced packages that are smaller, thinner, and lighterand achieve the higher performance afforded by advances in silicontechnology.

Sony’s 0.8mm-Pitch FBGA/FLGA uses an organic package substrate. Similarly to P-BGA, it uses wire bonding and transfer mold resin seal technology. The outer package outline conformes to EIAJ recommended design guidelines (ED-7316-7.8). Sony is targeting the market which wants to reduce the size of mother boards by replacing LQFP/QFP packages, and considers this product to be optimally suited to products in the consumer sector using 250 to 300 terminals or below. It is possible to select either ball-shaped and land-shaped terminals.

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